Components sourced by SSF GROUP(ASIA) LIMITED will undergo an advaned visual inspection process. In the rare case that a discrepancy is found during the inspection process the material in question will be sent to a third party testing facility.
SSF GROUP(ASIA) LIMITED ensures that all components meet the conforming manufacturers specifications. Certificates of Conformance are available upon request. In the event that an outsourced Professional third party is required, or requested, to test the material SSF GROUP(ASIA) LIMITED will employ an electronic engineer to conduct a visual inspection and authenticity verification of parts in question. The inspection procedure typically include (but are not limited to) the following:
Manufacturer PN, date code verification, RoHS compliance (if applicable).
Confirmation that electronic components match manufacturer product spec sheet.
Physical condition inspection (check for bent leads, chipped edges, scratches, etc.)
Chip mask inspection (faded marking, double print, broken text, font inspection, etc.)
Resistance to solvents testing
Inspection of moisture barrier protection bag, desiccants, and humidity indicator cards.
Packaging examined, shipping documents verified.
Current certification and accreditation required to provide services. Examples of common testing practices
X-Ray
Decapsulation
Solderability
Functional and Diagnostic Stress test
If SSF GROUP(ASIA) LIMITED or a third party partner, discovers any visual, physical, or electronic irregularity, we will escalate you (the customer) to for approval or in a rare case replacement.